U.S. Commerce Department to Award $50 Million to HP for Semiconductor Expansion

The U.S. Commerce Department announced plans to award $50 million to HP to support the expansion and modernization of its existing facility in Oregon, which will boost key semiconductor technologies.​

This funding is intended to enhance technologies serving life sciences instrumentation and technology hardware used in artificial intelligence applications.

Legislative Background on Semiconductor Support:

In August 2022, Congress approved a comprehensive $39 billion subsidy program for U.S. semiconductor manufacturing and related components.

This initiative includes $75 billion in government lending authority and a 25% investment tax credit, estimated to be worth $24 billion, marking a significant governmental push to bolster domestic. Funding million.

HP Project Focus and Technological Advancements:

The proposed funding will leverage HP’s expertise in cell-cellluidics and microelectromechanical systems (MEMS). It is set to support the manufacturing of silicon devices critical for life sciences lab equipment utilized in drug discovery, single-cell research, and cell line development.

Commerce Secretary Gina Raimondo highlighted the importance of this funding in enhancing the semiconductor supply chain and its role in drug discovery and vital life science equipment innovation.

This initiative’s technology improvements are expected to benefit esteemed partner institutions such as Harvard Medical School, the U.S. Centers for Disease Control and Prevention, and Merck.

HP’s Strategic Vision:

HP’s CEO, Enrique Lores, commented on the funding as a valuable opportunity to modernize and expand the facility while investing in microfluidics technology.

This initiative positions HP to play a crucial role in advancing semiconductor technology that is vital for health sciences.

Broader Funding Context:

Alongside HP’s award, the Commerce Department has outlined term sheets with 17 companies, offering more than $32 billion in grants and up to $29 billion in loans.

Other significant awards include $6.4 billion to Samsung for expanding chip production in Texas, $8.5 billion to Intel, and $6.6 billion to Taiwan’s TSMC, illustrating a comprehensive strategy to strengthen U.S. semiconductor capabilities.

All funding amounts are still subject to finalization, with the Commerce Department conducting due diligence. This process could adjust the awarded amounts, underscoring the ongoing developments in U.S. semiconductor support efforts.